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apds-9002 miniature surface-mount ambient light photo sensor data sheet description the apds-9002 is a low-cost analog-output ambient light photo sensor in lowest cost miniature chipled lead-free surface mount package. it consists of a spectrally suited phototransistor, which peaks in human luminosity curve. hence, it provides an excellent responsivity that is close to the response of human eyes, as shown in figure 2. it provides a design-alternative to the hsdl-9000 digital- output ambient light photo sensor is suitable for portable applications with its ultra small package design. the apds-9002 is ideal for applications in which the measurement of ambient light is used to control display backlighting. mobile appliances such as the mobile phones and pdas that draw heavy current from display backlighting will benefi t from incorporating these photo sensor products in their designs by reducing power con- sumption signifi cantly. features ?? excellent responsivity which peaks in the human luminosity curve C close responsivity to the human eye ?? miniature chipled lead-free surface-mount package C height C 0.80 mm C width C 2.00 mm C depth C 1.25 mm ?? good output linearity across wide illumination range ?? low sensitivity variation across various light sources ?? guaranteed temperature performance: -40 c to 85 c ?? vcc supply 2.4 to 5.5 v ?? lead-free package applications ?? detection of ambient light to control display back- lighting C mobile devices C mobile phones, pdas C computing devices C notebooks, webpads C consumer devices C tvs, video cameras, digital still cameras ?? automatic residential and commercial lighting management ?? electronic signs and signals ?? daylight and artifi cial light exposed devices
2 i/o pins confi guration table pin symbol description 1 iout i out 2 vcc v cc 3 vcc v cc 4 nc no connect application support information the application engineering group is available to assist you with the application design associated with apds-9002 ambient light photo sensor module. you can contact them through your local sales representatives for additional details. ordering information part number packaging type package quantity apds-9002-021 tape and reel 4-pins chipled package 2500 typical application circuit figure 1 table component recommended application circuit components r load 1 k ? figure 1. typical application circuit for apds-9002. pin 2: vcc pin 3: vcc apds-9002 pin 4: nc pin 1: iout r load
3 caution: it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by esd. normalized responsivity 0 wavelength (nm) 0.5 0.1 0.4 1.1 1.0 450 650 550 1250 1150 1050 950 850 750 350 0.7 0.2 0.3 0.6 0.9 0.8 apds-9002 silicon eye response figure 2. relative spectral response vs. wavelength. absolute maximum ratings for implementations where case to ambient thermal resistance is 50c/w parameter symbol min. max. units storage temperature t s -40 85 c operating temperature t a -40 85 c supply voltage v cc 2.4 5.5 v recommended operating conditions parameter symbol min. max. units conditions operating temperature t a -40 85 c supply voltage v cc 2.4 5.5 v
4 electrical & optical specifi cations (t a = 25 c) parameter symbol min. typ. max. units conditions photo current (i) i_ ph1 10 20 33 ? a v cc = 3.0 v, lux = 10 [2] photo current (ii) i_ ph2 136 250 410 ? a v cc = 3.0 v, lux = 100 [2] photo current (iii) i_ ph3 C 300 C ? a v cc = 3.0 v, lux = 100 [1] dark current i_ dark C 50 160 na v cc = 3.0 v, lux = 0 light current ratio i_ ph3 / i_ ph2 C 1.2 C C C rise time t_ rise C 0.95 2 ms v cc = 3.0 v, lux = 100, rload = 1 k ? [3] fall time t_ fall C 0.8 2 ms v cc = 3.0 v, lux = 100, r load = 1 k ? [3] notes: 1. illuminance by cie standard light source (incandescent lamp). 2. fluorescent light is used as light source. white led is substituted in mass production. 3. white led is used as light source. light measurement circuit and waveforms r load tr i_pulse i_pulse v out gnd pin 2: vcc apds-9002 pin 3: vcc pin 4: nc pin 1: iout tf 90% 10%
5 figure 3. photocurrent vs. luminence (v cc = 3 v, t a = 25 c). figure 4. normalized photocurrent vs. temperature (v cc = 3 v, 100 lux). figure 5. normalized photocurrent vs. angle (v cc = 3 v, t a = 25 c). figure 6. output voltage vs. luminance at diff erent load resistor. figure 7. fall time vs. r load . figure 8. rise time vs. r load . lux photocurrent (a) 0.01 0.001 0.0001 0.00001 10 100 1000 temperature (c) normalized photocurrent 2.5 1.5 2.0 1.0 0 -50 0 50 100 angle normalized photocurrent 1.2 1.0 0 -80 -60 -40 -20 0 20 40 60 80 0.2 0.4 0.6 0.8 luminance, ev (lux) output voltage, v out (v) 10 1 0.01 0.001 10 100 1000 0.1 r load ( : ) fall time (sec) 000.0e+0 200.0e-6 400.0e-6 600.0e-6 800.0e-6 1.0e-3 1.2e-3 1.4e-3 500 0 1000 1500 2000 2500 r load ( : ) trise (sec) 000.0e+0 200.0e-6 400.0e-6 600.0e-6 800.0e-6 1.0e-3 1.2e-3 1.6e-3 1.4e-3 1.8e-3 500 0 1000 1500 2000 2500 incandescent fluorescent normalized photocurrent normalized photocurrent r = 1 k : r = 5.1 k : r = 11 k : r = 51 k : average average t a = 25c v cc = 3 v light source: white led
6 apds-9002 package outline 1.40 1.25 p2 p4 p3 p1 2.00 0.45 0.35 r0.20 0.45 0.45 0.20 0.14 pin 1: iout pin 2: vcc pin 3: vcc pin 4: nc (no connect) units: in mm tolerance: 0.2 mm 0.80 0.30 p.c. board molding body (lens)
7 apds-9002 tape and reel dimensions progressive direction orientation of unit in tape and reel pockets in progressive direction material of carrier tape: conductive polystyrene material of cover tape: pvc method of cover: heat sensitive adhesive empty unit: mm "b" "c" 178 75 (400 mm min.) (40 mm min.) (40 mm min.) leader parts mounted empty detail a 20.2 (min.) 15.4 (max.) r1.0 dia. 13.0 0.50 2.0 0.50 detail a label ? 1.56 0.1 ? 1.00 0.1 2.00 0.05 1.75 0.1 3.50 0.05 8 0.1 0.20 1.04 0.1 4.00 0.1 4.00 0.1 1.96 0.1 1.04 0.1 c 18.4 (max.) b 1.25 p2 p4 p3 p1 2.00 0.20
8 baking conditions if the parts are not stored in dry conditions, they must be baked before refl ow to prevent damage to the parts. package temp. time in reels 60 c 20 hours in bulk 125 c 5 hours baking should only be done once. recommended storage conditions storage temperature 10 c to 30 c relative humidity below 60% rh time from unsealing to soldering after removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. if times longer than three days are needed, the parts must be stored in a dry box. moisture proof packaging all apds-9002 options are shipped in moisture proof package. once opened, moisture absorption begins. this part is compliant to jedec level 4. units in a sealed moisture-proof package package is opened (unsealed) environment less than 30 c, and less than 60% rh package is opened less than 72 hours perform recommended baking conditions no baking is necessary yes no no yes
9 recommended refl ow profi le 0 t-time (seconds) t ?temperature ?( c) 230 200 160 120 80 50 150 100 200 250 300 180 220 255 p1 heat up p2 solder paste dry p3 solder reflow p4 cool down 25 r1 r2 r3 r4 r5 60 sec. max. above 220 c max. 260 c process zone symbol ? t maximum ? t/ ? time heat up p1, r1 25 c to 160 c 4c/s solder paste dry p2, r2 160 c to 200 c 0.5c/s solder refl ow p3, r3 200 c to 255 c (260 c at 10 seconds max.) 4c/s p3, r4 255 c to 200 c -6c/s cool down p4, r5 200 c to 25 c -6c/s the refl ow profi le is a straightline representation of a nominal temperature profi le for a convective refl ow solder process. the temperature profi le is divided into four process zones, each with diff erent ? t/ ? time temperature change rates. the ? t/ ? time rates are detailed in the above table. the temperatures are measured at the component to printed circuit board connections. in process zone p1 , the pc board and apds-9002 castella- tion pins are heated to a temperature of 160 c to activate the fl ux in the solder paste. the temperature ramp up rate, r1, is limited to 4 c per second to allow for even heating of both the pc board and apds-9002 castellations. process zone p2 should be of suffi cient time duration (60 to 120 seconds) to dry the solder paste. the temperature is raised to a level just below the liquidus point of the solder, usually 200 c (392 f). process zone p3 is the solder refl ow zone. in zone p3, the temperature is quickly raised above the liquidus point of solder to 255 c (491 f) for optimum results. the dwell time above the liquidus point of solder should be between 20 and 60 seconds. it usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connec- tions. the temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200 c (392 f), to allow the solder within the connections to freeze solid. process zone p4 is the cool down after solder freeze. the cool down rate, r5, from the liquidus point of the solder to 25 c (77 f) should not exceed 6 c per second maximum. this limitation is necessary to allow the pc board and apds-9002 castellations to change dimensions evenly, putting minimal stresses on the apds-9002.
10 appendix a: smt assembly application note avago apds-9002: miniature surface-mount ambient light sensor figure 9. stencil and pcba. 1.1 recommended land pattern 0.55 0.55 0.55 0.55 1 0.45 pcba stencil aperture solder mask metal stencil for solder paste printing land pattern aperture opening 2.2 1.65 0.1 unit: mm 2.65 mounting center unit: mm 3.2 0.2 min. figure 10. solder stencil aperture. figure 11. adjacent land keepout and solder mask areas. 1.2 recommended metal solder stencil aperture it is recommended that a 0.10 mm (0.004 inches) thick stencil be used for solder paste printing. aperture opening for shield pad is 0.6 mm x 0.6 mm. this is to ensure adequate printed solder paste volume and no shorting. 1.3 adjacent land keepout and solder mask areas adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. there should be no other smd components within this area. the minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. note: wet/liquid photo-imageable solder resist/mask is recommended.
11 appendix b: optical window design for apds-9002 2.0 optical window dimensions to ensure that the performance of the apds-9002 will not be aff ected by improper window design, there are some constraints on the dimensions and design of the window. there is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not aff ect the angular response of the apds-9002. this minimum dimension that is recommended will ensure at least a 35 light reception cone. if a smaller window is required, a light pipe or light guide can be used. a light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal refl ection to focus the light. the thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to refl ection (4% on each side) and an additional loss of energy in the plastic material. figures 12(a) and 12(b) illustrate the two types of windows that we have recommended which could either be a fl at window or a fl at window with light guide. figure 12(a). window size determination for fl at window. figure 12(b). window design of fl at window with light guide. flat photo light sensor
12 photo light sensor t l z d1 top view d1 d1 window diameter t thickness l length of light pipe z distance between window rear panel and apds-9002 table 1 and figure 13 below show the recommended dimensions of the window. these dimension values are based on a window thickness of 1.0 mm with a refractive index 1.585. the window should be placed directly on top of the photo light sensor to achieve better performance and if a fl at window with a light pipe is used, dimension d2 should be 1.5 mm to optimize the performance of apds-9002. 2.1 optical window material the material of the window is recommended to be poly- carbonate. the surface fi nish of the plastic should be smooth, without any texture. the recommended plastic material for use as a window is available from bayer ag and bayer antwerp n. v. (europe), bayer corp. (usa) and bayer polymers co., ltd. (thailand), as shown in table 2. table 1. recommended dimension for optical window all dimensions are in mm wd (t+l+z) flat window (l = 0.0) flat window with light pipe (d2 = 1.5; z = 0.5) z d1d1l 1.5 0.5 2.25 C C 2.0 1.0 3.25 C C 2.5 1.5 4.25 C C 3.0 2.0 5.00 2.5 1.5 table 2. recommended plastic materials material number visible light transmission refractive index makrolon lq2647 87% 1.587 makrolon lq3147 87% 1.587 makrolon lq3187 85% 1.587 figure 13. recommended window dimensions.
13 appendix c: general application guide for apds-9002 the apds-9002 is a low cost analog-output ambient light photo sensor which spectral response closely emulates the human eyes. apds-9002 consists of a phototransis- tor that enables the photo sensor to produce a high gain photo current to a suffi cient level that can be converted to voltage with a standard value of external resistor. apds-9002 is then easily integrated into systems that use adc input which is available for sampling of the external source, as shown in figure 14 below. selection of the load resistor r l will determine the amount of current-to-voltage conversion in the circuit. based on figure 14 and using white led as the light source, mea- surement has been carried out by using diff erent load resistors to examine the variation of the output voltage towards the intense of lux. the result is shown in graph 1. apds-9002 allows output voltage hits around 2.3 v, after this it saturates. light source, e.g., fl uorescent light, consists of ac noise about 100 hz frequency. a capacitor of 10 ? f, which acts as a low-pass fi lter, is recommended to add in parallel with resistor to by-pass the ripples. the amount of converted voltage, v out , is mainly dependant proportionally on the photo current which is generated by the brightness of the light shone on the photo sensor and the load resistor used, r l . increasing the brightness of the light and/or the load resistor will increase the output voltage. brightness is measured as lux unit, which describes how intense a light source that our eyes perceive. lux meter is the equipment for lux measurement. light sources with the same lux level appear at the same brightness to the human eyes. luminance, ev (lux) output voltage, v out (v) 10 1 0.01 0.001 10 100 1000 0.1 r = 1 k : r = 5.1 k : r = 11 k : r = 51 k : t a = 25c v cc = 3 v light source: white led r l c v cc apds-9002 v cc v out nc 4 2 light source 3 a/d micro- controller 1 graph 1. output voltage vs. luminance at diff erent load resistor. figure 14. confi guration of apds-9002 being used directly.
figure 15. evaluation board layout. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2012 avago technologies. all rights reserved. obsoletes 5989-3051en av02-3579en - june 11, 2012 avago has fabricated an evaluation board based on the confi guration shown in figure 14 for the designer to test the ambient light sensor under diff erent lighting condi- tions. a reference layout of a 2-layout avago evaluation board for apds- 9002 is shown in figure 15 below.

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